aSPIre 3Measurement-based 3D SPI
See solder print in measurement-based 3D.
- Measurement-based 3D
- Warp compensation
- WFMI
- KSMART / KPO
Koh Young aSPIre 3. True 3D SPI that resists shadow, specular reflection, and board warp—measuring solder down to 03015. Choose resolution and chassis for the application.
Product overview
View post-print solder volume, height, and position as 3D measurements—not image matching. Fewer escapes and false calls, with data that improves the print process.
Configure for the line: in-line/off-line, single/dual lane, M–2XL chassis, and camera/lens combinations.
Measurement-based 3D inspection
Multi-directional projection
Proprietary multi-direction projection measures height while limiting shadow and specular effects. High repeatability even on production 03015 solder.
Choose 2–4 direction moiré. Measurement stays stable even when board orientation changes.
More than solder
Whole-board foreign material inspection (WFMI)
Beyond solder, inspect whole-board foreign material, conductive adhesive, and sinter paste in full color. Also useful for non-print dispense inspection.
Board-warp compensation
Z-tracking 3D + Pad-referencing 2D
Z-tracking 3D compensation reads tilt, stretch, twist, and warp during inspection so height stays stable on warped boards.
Optional Pad-referencing 2D uses IR lighting to read pad position and correct CAD ideal-shape offset in real time—including nonlinear shrinkage.
Self-diagnostics
Periodically check 3D/2D light levels, PZT travel, height accuracy, XY offset, and more. Fewer unplanned stops while keeping the machine in known-good condition.
KSMART
Turn 3D measurement into process improvement
Collect SPI/AOI data across the line for defect trends, real-time optimization, and traceability. Cut false calls and escapes while balancing quality and cost.
KPO Printer
Tune the print process automatically
Monitors print results, notifies on thresholds, and proposes process variables. Even without a constant expert on hand, print conditions can be steered in real time. Optional automatic solder rework (dispense).
Configuration
Combine resolution and chassis
Cameras: 4 / 8 / 12 MP. Telecentric lenses: 10 / 15 / 20 μm. Inspection speed 13.3–91.2 cm²/s depending on resolution.
Chassis: M / L / XL / 2XL. Dual Lane available except 2XL. Max board on 2XL: 1,500 × 690 mm.
Chassis size (reference)
| Item | L | XL | 2XL |
|---|---|---|---|
| Max. board | 490 × 510 mm | 830 × 690 mm | 1,500 × 690 mm |
Specifications
- Manufacturer
- Koh Young
- Model
- aSPIre 3
- Type
- 3D SPI (solder paste inspection)
- Camera
- 4 / 8 / 12 MP
- Lens
- 10 / 15 / 20 μm (telecentric)
- Projection
- 2–4 direction moiré
- Line configuration
- In-line / off-line, single / dual (excl. 2XL)
- M-size and Dual Lane board dimensions vary by configuration.
- KSMART, KPO Printer, Pad-referencing, and automatic rework are optional.
- Specifications and appearance are subject to change without notice for improvement.
Contact
Questions or consultation requests are welcome.